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Preliminary ?
MT9V032: 1/3-Inch Wide-VGA Digital Image Sensor
Package Dimensions
Package Dimensions
Figure 5:
D
48-Pin CLCC Package Outline Drawing
2.3 ±0.2
1.7
Seating
plane
A
Substrate material: alumina ceramic 0.7 thickness
Wall material: alumina ceramic
Lid material: borosilicate glass 0.55 thickness
47X
1.0 ±0.2
48X
0.40 ±0.05
4.4
8.8
48 1
0.8
TYP
48X R 0.15
1.75
H CTR
?0.20 A B C
First
clear
pixel
5.215
4.84
8.8
4.4
5.715
0.8 TYP
11.43
V CTR
?0.20 A B C
Image
10.9 ±0.1
CTR
sensor die:
4X
0.2
0.675 thickness
5.215
11.43
5.715
B
C
A
0.05
0.10 A
Optical
area
Optical area:
10.9 ±0.1
CTR
Optical
center 1
Lead finish:
Au plating, 0.50 microns
minimum thickness
over Ni plating, 1.27 microns
minimum thickness
1.400 ±0.125
0.90
for reference only
0.35
for reference only
Maximum rotation of optical area relative to package edges: 1o
Maximum tilt of optical area relative to
seating plane A : 50 microns
Maximum tilt of optical area relative to
top of cover glass D : 100 microns
Notes:
1. Optical center = package center.
2. All dimensions are in millimeters.
PDF: 09005aef824c9998/Source: 09005aef824c999c
MT9V032_LDS_2.fm - Rev. B 3/07 EN
9
Micron Technology, Inc., reserves the right to change products or specifications without notice.
?2006 Micron Technology, Inc. All rights reserved.
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Obsolescence Mitigation Program 标准包装:1 系列:-
MT9V032L12STCH ES
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Obsolescence Mitigation Program 标准包装:1 系列:-
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Obsolescence Mitigation Program 标准包装:1 系列:-
MT9V032L12STMH ES
功能描述:KIT HEAD BOARD FOR MT9V032 RoHS:是 类别:编程器，开发系统 >> 评估板 - 传感器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program 标准包装:1 系列:-